Lead Reconfigurable Memory Computing to the Feature

EdgeCard

Process

Frequency

Support for Computing Precision

Peak INT8 TOPS

Memory Capacity

Interface

Thermal Cooling Solution

Form Factor

F12810E

16nm

8x DDR 4 1GB

bit width: 64bit

bandwidth: 19.2GB/s

SFP x 4

200MHz

0.819TOPS

active

INT8

INT16

FP16

FP32

240mm x 120mm

Product Parameters

Support to Various 
Application Scenarios

▪    Reconfigurable Computing-in-Memory technology for multi-operator support

▪    Adaptatibility to multiple models

▪    Compatibility with multiple frameworks to support various application scenarios

High Density Surge Computing Power

▪    Advanced Computing-in-Memory architecture with advanced process

▪    Multi-core & multi-chip for efficient and high-density AI computing power

Flexible and Highly Compatible Development Platform

▪    A development platform built on a universal AI platform

▪    Supports multiple mainstream deep learning frameworks

▪    Simplifies the development flow and easily ports existing algorithms

Ultra-Low Energy Cost on Operation

▪    Breaks the traditional power comsumption wall for data transformation, with ultra-high energy efficiency ratio to bring excellent deployment operation cost performance