CloudCard
F12010
Process
Frequency
16nm
200MHz
Support for Computing Precision
INT8
INT16
FP16
FP32
Peak INT8 TOPS
1.638TOPS
Memory Capacity
2x DDR 4 16GB
bit width: 512bit
bandwidth: 154GB/s
Interface
PCIe Gen3 x 16
Compatible PCIe Gen 4 x 8
bandwidth: 16GB/s
Thermal Cooling Solution
passive
Form Factor
Double slot, full height 3/4 length
F11610E
16nm
1x DDR 4 16GB
bit width: 256bit
bandwidth: 102.4GB/s
PCIe Gen3 x 16
Compatible PCIe Gen 4 x 8
bandwidth: 16GB/s
162MHz
145TOPS
passive
INT8
INT16
FP16
FP32
G41210E
12nm
4x 32GB
bit width: 512bit
bandwidth: GDDR5:512GB/s
GDDR5X:704GB/s
GDDR6:1024GB/s
PCIe Gen4 x 16
bandwidth: 32GB/s
1.2GHz
>1000TOPS
passive
INT8
INT16
FP16
FP32
G40710E
7nm
PCIe Gen4 x 16
bandwidth: 32GB/s
1.6GHz
>4000TOPS
passive
INT8
INT16
FP16
FP32
Double slot, full height and full length
Double slot, full height and full length
Double slot, full height and full length
4x 32GB
bit width: 512bit
bandwidth: GDDR5:512GB/s
GDDR5X:704GB/s
GDDR6:1024GB/s
Product Parameters
Support to Various
Application Scenarios
▪ Reconfigurable Computing-in-Memory technology for multi-operator support
▪ Adaptatibility to multiple models
▪ Compatibility with multiple frameworks to support various application scenarios
High Density Surge Computing Power
▪ Advanced Computing-in-Memory architecture with advanced process
▪ Multi-core & multi-chip for efficient and high-density AI computing power
Flexible and Highly Compatible Development Platform
▪ A development platform built on a universal AI platform
▪ Supports multiple mainstream deep learning frameworks
▪ Simplifies the development flow and easily ports existing algorithms
Ultra-Low Energy Cost on Operation
▪ Breaks the traditional power comsumption wall for data transformation, with ultra-high energy efficiency ratio to bring excellent deployment operation cost performance
Application Scenarios
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